Graphics card thermal silicone - thermal conductivity 3.0- the main characteristics and functions of transistor thermal silicone

Product characteristics

It has the characteristics of good thermal conductivity, strong insulation and high temperature resistance, and is used to fill the gap between the graphics card core chip (GPU) and the heat sink to improve the heat conduction efficiency, so as to effectively reduce the temperature of the graphics card.


Environmental requirements: comply with RoHS directive and related environmental requirements

Citation standard :HG/T 3947-2007 single component RT-vulcanized silicone adhesive/sealant


Scope of application

Graphics card thermal conductive silicone can be widely coated in a variety of electronic products, electrical equipment in the heating body (power tube, thyristor, electric heating pile, etc.) and heat dissipation facilities (heat sink, heat strip, shell, etc.) between the contact surface, heat transfer media. Suitable for microwave communication, microwave transmission equipment, microwave special power supply, voltage regulation power supply and other microwave devices surface coating or integral pooping, such silicon materials for heat generation of electronic components, provide excellent thermal conductivity effect. Such as: transistors, CPU assembly, thermistors, temperature sensors, automotive electronic parts, automotive refrigerators, power modules, printers and so on.


Product standard

◆ In line with GB 33372-2020(VOC) volatile organic compounds certification, ◆ in line with REACH EU testing standards, ◆ enterprises through the flame retardant grade UL certification E358706◆ISO14001:2015 certification, ◆ISO9001:2015 certification, ◆ reference standard: HG/T3947-2007 Single component room temperature vulcanized silicone adhesive/sealant ◆ Passed the national high-tech enterprise certification ◆ Our products have passed 1000 hours of cold and heat shock test, 1000 hours of double 85(high temperature and high humidity) test, 1000 hours of high temperature aging test, committed to providing reliable thermal conductivity solutions for automotive, communications, security and other industries.


Application industry

Graphics card thermal conductive silica gel is widely used in: home appliance industry, electronics industry, communication industry, security industry, automobile industry, sports equipment industry, shipbuilding industry, etc.


Electrical/mechanical properties (At TA=25℃)

Argument Symbol Test standard Performance index
Hardness shore A


GB/T 531.1


Elongation %


GB/T 528


Tensile strength MPa


GB/T 528


Shear strength MPa


GB/T 7124


Dielectric strength kV/mm


GB/T 1695


Dielectric constant 1.0MHz


GB/T 1693


Volume resistivity Ω·cm


GB/T 1692



Limiting parameter number (AtTA =25℃)



Numerical value

Table drying time min



Curing time H



Thermal conductivity W/m·K



Specific gravity g/cm³



Operating temperature


-60°C To +260°C

Storage temperature


 10°C To +25°C 


The main features and functions of the graphics card thermal silicone include

1, thermal conductivity: graphics card thermal silicone usually contains high thermal conductivity fillers, such as metal oxides, which can effectively improve the heat conduction efficiency between the radiator and the graphics card chip, reduce the temperature, and ensure the stable operation of the graphics card.

2, insulation performance: thermal conductive silica gel has good insulation performance, can isolate the direct contact between the graphics card chip and the radiator, to avoid problems that may lead to short circuit or electrical failure.

3, high temperature resistance: thermal conductive silica gel is usually able to withstand high working temperature, to ensure that the graphics card for a long time high load working case, can still maintain a stable heat dissipation effect.

4, stability and durability: thermal silica gel has good durability, not easy to deteriorate, dry or loss, can maintain good thermal conductivity for a long time.

When using the graphics card thermal silicone, you need to clean the surface of the graphics card chip and the heat sink first, remove the previous thermal silicone residue, and then evenly apply the appropriate amount of thermal silicone on the chip, and then close the heat sink to the chip. Pay attention to apply evenly and thinly to avoid excessive pressure.

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