SD6341 electronic potting adhesive universal epoxy adhesive 5:1, adhesive cured perfectly without marks

Product model: SD6341 epoxy resin potting adhesive

Characteristics: This product has excellent resistance to high temperature, medium, and aging. It has good high-temperature resistance and adhesive performance, high transparency, perfect without marks after sealing and curing of the adhesive, flat and bright surface without bubbles, strong adhesion without heating, can be cured at room temperature, environmentally friendly and non-toxic.

Environmental requirements: Comply with RoHS directives and related environmental requirements

 

Executive standard for epoxy resin sealing adhesive

Complies with GB 33372-2020 (VOC) certification for volatile organic compounds, REACH EU testing standards, and the enterprise has passed UL certification for flame retardancy level E358706, ISO14001:2015 certification, ISO9001:2015 certification. Reference standard: HG/T3947-2007, single component room temperature vulcanization requires silicone adhesive/sealant. Through national high-tech enterprises. Our products have passed 1000 hours of cold and hot impact testing, 1000 hours of dual 85 (high temperature and humidity) testing, and 1000 hours of high temperature aging testing, committed to providing reliable thermal conductivity solutions for industries such as automobiles, communication, and security.

 

Application of SD6341 epoxy resin sealing adhesive

Mainly used in lighting module, light string base, LED backlight assembly, LED luminous strip sealing, seam filling, and subsequent applications; Sealing of bridge rectifier and high-temperature electronic components, electrolytic capacitors, and high-voltage coils; Sealing of ignition coils and electronic components; Sealing of electronic components such as thermal protectors (optional resin with flame resistance, high heat resistance, and medium temperature hardening); Insulation encapsulation for capacitors and other electronic components, (room temperature hardening flame-retardant encapsulation resin can be selected), etc. Customers can choose the desired products based on the manufacturing process, and we can customize them for different usage (technology, process) requirements.

 

Technical parameters of SD6341 epoxy resin sealing adhesive

performance index

Testing items

Reference standards

unit

num

solid
turn
ago

Appearance

visualization

/

Black (A)/Brown (B) Flow Body

Color after mixing

visualization

/

black

Component A viscosity

GB/T 2794-1995

mPa·s

12000~13000

Component B viscosity

GB/T 2794-1995

mPa·s

40~120

 

exercise
do
nature
can

Dual component mixing ratio (weight ratio) A: B

/

/

4 :1

Viscosity after mixing

GB/T 2794-1995

mPa·s

800~1000

surface drying time

GB/T 7123.1-2015

min

40

Curing Time (25℃)

GB/T 7123.1-2015

H

8~24

Curing Time (80℃)

GB/T 7123.1-2015

H

1~3

elative Specific Gravity

GB/T 13477.2-2002

g/cm³

1.6±0.1

 

solid
turn
after

Hardness

GB/T 531-1999

shore D

80±10

Dielectric strength

GB/T 1694-1981

kV/mm

≥18

Dielectric constant

GB/T 1694-1981

60Hz

≥2.8

Volume resistivity 

GB/T 1692-92

Ω·cm

≥2.0×1014

Operating temperature range

/

/

-40℃~150℃

Appearance

 

 

black

 

 

 

 

 

 

 

 

 

 

 

 

 

Usage and precautions of SD6341 epoxy resin sealing adhesive

Weighing: Accurately weigh components A and B, and mix them thoroughly in a 4:1 (mass) ratio. Before weighing, separate components A and B should be stirred evenly to evenly disperse the settled filler into the gel to avoid affecting the colloidal properties.

 

Mixing: Use manual or machine mixing to thoroughly and evenly mix the rubber material, so that the rubber material has a uniform color. When using manual glue filling process, it is important to note that the one-time amount of glue should not be too much to avoid difficulty in glue filling due to reduced fluidity in the later stage.

 

Defoaming: It is recommended to place the evenly mixed rubber material in a vacuum cabinet for defoaming, and use vacuum pumping to remove air entrainment during the mixing process.

 

Sealing: Pour the adhesive material that has completely removed the bubbles into the device to complete the sealing operation. Before sealing, the surface of the device and the container used for mixing should be kept clean and dry.

 

Curing: Cure the encapsulated device at room temperature. The viscosity of the mixed colloid will gradually increase with time, and attention should be paid to controlling the sealing within an operable time.

 

This product is not a hazardous material, but do not enter or eye contact.

Store in a cool and dry place, avoiding rain and sunlight. The shelf life is nine months under unopened conditions at 26 ℃.

This product cannot be mixed with other types of colloids!

 

SD6341 Epoxy Resin Sealing Adhesive Packaging, Storage, and Transportation Requirements

Transportation: There are no regulations in China (CN-GB) or internationally (IMO, IATA, UN). It belongs to non hazardous goods.

 

Packaging:

① The packaging of materials has a certain protective and sealing effect on the materials, ensuring that they are not damaged during transportation.
② The packaging box should have product model, name, quantity, manufacturer's trademark, production batch, and other information.
③ The packaging box should meet the requirements of moisture resistance, shock resistance, pressure resistance, and mold resistance.

 

Storage: Products packaged in boxes should be stored in a cool and dry environment with an ambient temperature below 26 ℃. The surrounding air should be free of acidic, alkaline, or other corrosive gases. Under these conditions, the product can be stored for nine months from the production date, and the material remains qualified within these nine months.

 

Packaging specifications

Each group is 31.25kg, including 25kg/barrel of main agent and 6.25kg/barrel of curing agent.

Each group is 1.25kg, including 1kg/barrel of main agent and 0.25kg/barrel of curing agent.

 

SD6341 epoxy resin potting adhesive declaration

Users must carefully read the relevant information of this product before using it. Users are responsible for conducting comprehensive tests based on their respective uses to confirm its performance, effectiveness, safety, etc.
Our company denies any other expressed or implied warranties. If your company fails to conduct corresponding performance tests and directly uses the product, resulting in unqualified products, our company and the intermediary sales legal person shall not bear any responsibility. We hereby declare!

Product description

Characteristics: SD6341 electronic potting adhesive universal epoxy adhesive is a two component epoxy adhesive used for sealing and protecting modules and circuit boards. It can be cured at room temperature or by heating, with less heat release during curing and low shrinkage rate; After curing, the adhesive has excellent electrical properties and good water resistance.
Application: Suitable for surface coating, dripping and sealing of various LED lamps, circuit boards, modules and other products; Other products require highly transparent packaging and potting; Other characteristics.


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