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Two component epoxy resin structure AB adhesive 829B
SD829 is a two component epoxy resin structural adhesive used for room temperature or low temperature curing. After curing, the subsequent layer has high hardness, which can withstand extremely strong impacts and vibrations. It has good mechanical properties and electrical insulation, and can withstand temperature changes and bending and tearing stress.
关键词：
隐藏域元素占位
Two component fast curing epoxy resin structural adhesive 812
SD812 is a two component fast curing epoxy resin structural adhesive used for rapid curing at room temperature. After curing, the next layer has a medium hardness, which can withstand extremely strong impacts and vibrations. The next layer has good mechanical properties and electrical insulation, can withstand temperature changes and bending tear stress, and is non corrosive. Has a wide temperature resistance range of -50~120 ℃.
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隐藏域元素占位
Super strong epoxy resin AB adhesive, 805 two component fast curing epoxy resin structural adhesive
SD805 super strong epoxy resin AB adhesive is a two component fast curing epoxy resin structural adhesive prepared using advanced technology and process. It has the main advantages of transparency, environmental protection, and high-strength bonding, good toughness, water resistance, impact resistance, and acid alkali resistance, as well as high and low temperature (-60-150 ℃) electrical insulation. Suitable for bonding various high-end ceramics, granite, metal, crystal jade, high-end handicrafts, sports goods, leisure and entertainment equipment, luxury furniture decoration, digital technology products manufacturing and repair, all bonded products are perfect and traceless.
关键词：
隐藏域元素占位
Two component low odor acrylic AB structural adhesive, 801
SD801 is a two component low odor acrylic structural adhesive that produces a milder odor than traditional acrylic adhesives when applied. The operation time is 3-5 minutes, and the curing positioning is 5-10 minutes. It reaches the usable level after 1 hour. After complete curing, it has characteristics such as high shear, high peeling, and good impact resistance. Suitable for bonding most metals, ceramics, rubber, wood, etc. Temperature resistance range: -30~120 ℃.
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隐藏域元素占位
SD6108 two-component silicone potting glue 10:1, moisture-proof potting protective glue for electronic appliances
Overview: SD6108 electronic potting glue is a room temperature curing condensation two-component silicone potting product. There is no need to use other primers before use. It has a good bonding effect on most materials and can be cast to the smallest detail. , the shrinkage is small during the curing process. It has good waterproof, moisture-proof and anti-aging properties. It can be used outdoors for a long time. It has long-lasting adhesion and maintains rubber elasticity in the range of -40~200℃. It is suitable for fixing accessories and is waterproof, dustproof and anti-leakage. It has excellent insulation properties. , whose common advantages are: rapid curing, long operating time, and can effectively improve production efficiency. It has good fluidity, can be self-leveled quickly, and can be used with automatic glue filling equipment. The cured product has good adhesion to module kits (metal, plastic, etc.) and LED lights, and has excellent high and low temperature resistance and electrical properties. It has insulating properties, good flexibility, and is detachable. The sealed components can be taken out for repair and replacement, and then the potting can be used for repair without leaving traces. Application: Used for potting protection of general electronic components, power modules and printed circuit boards, waterproof, moisture-proof, high voltage resistance; and potting of automotive electrical appliances and various electronic appliances.
关键词：
隐藏域元素占位
SD6105 two-component flame retardant thermal conductive potting compound 1:1, automotive electrical potting protective sealant
Features: SD610 thermally conductive and flame-retardant potting glue does not pollute the surrounding environment; it can be cured at room temperature or by heating. The higher the temperature, the faster the curing. This product does not produce any by-products during the curing reaction and can be applied to PC (Poly-carbonate), PP, ABS, PVC and other materials and metal surfaces.\ Application: Mainly suitable for potting protection of general electronic components, power modules and printed circuit boards, waterproof and moisture-proof, high voltage resistance, potting of automotive electrical appliances and various electronic appliances; module power supplies and power supplies with high heat dissipation and temperature resistance requirements Potting protection for circuit boards.
关键词：
隐藏域元素占位
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